Production Line PCB Serial Programming and Testing Method and System

ABSTRACT

A system and method for testing a wireless earpiece which provided improved efficiencies in manufacturing. Automated testing of one or more printed circuit boards of the wireless earpiece is initiated. The semi-assembled wireless earpiece is tested. End-of-line functional testing is performed. Final acoustic testing of the wireless earpiece is performed.

PRIORITY STATEMENT

This application claims priority to U.S. Provisional Patent ApplicationNo. 62/211,725, filed Aug. 29, 2015, hereby incorporated by reference inits entirety.

FIELD OF INVENTION

The present invention relates to wireless device manufacturing. Moreparticularly, but not exclusively, the present invention relates toproduction line PCB serial programming and testing.

BACKGROUND

Usage of wireless devices has grown significantly in recent years asmanufacturing processes, devices, and wireless standards have improved.As wireless devices become smaller and more portable, space limitationsfor components and circuitry become even more constrained. Spaceconstraints are particularly limited for wireless earpieces. Such spaceconstraints preclude the usage of significant number of tests points fordevice layouts utilizing printed circuit boards (PCBs). As a result,testing PCBs during the manufacturing process may be difficult,potentially resulting in additional time and equipment requirements,failed devices, extra troubleshooting, and additional expense.

SUMMARY

One aspect includes a system, method, and testing device including aprocessor and memory with instructions that are executed to test awireless earpiece. Automated testing of one or more printed circuitboards of the wireless earpiece is initiated. The semi-assembledwireless earpiece is tested. End-of-line functional testing isperformed. Final acoustic testing of the wireless earpiece is performed.

Another aspect includes a system for testing a wireless earpiece. Thesystem may include a computing device connected to the wirelessearpiece. The system may also include a reference wireless earpiececonnected to the computing device. The computing device may beconfigured to initiate automated testing of one or more printed circuitboards (PCBs) of the wireless earpiece, test the semi-assembled wirelessearpiece, perform end-of-line functional testing, and perform finalacoustic testing of the wireless earpiece.

BRIEF DESCRIPTION OF THE DRAWINGS

Illustrative embodiments of the present invention are described indetail below with reference to the attached drawing figures, which areincorporated by reference herein and wherein:

FIG. 1 is a pictorial representation of a testing system in accordancewith an illustrative embodiment;

FIG. 2 is a flowchart of a process for testing a PCB of a wirelessearpiece in accordance with an illustrative embodiment;

FIG. 3 is a flowchart of a process for initiating an automatedproduction panel testing in accordance with an illustrative embodiment;

FIG. 4 is a flowchart of a process for performing semi-assembly of thewireless device in accordance with an illustrative embodiment; and

FIG. 5 depicts a computing, system 500 in accordance with anillustrative embodiment.

DESCRIPTION

The illustrative embodiments provide a system and method for productionline PCB serial programming and testing. In one embodiment, the PCBs maybe a component of a wireless earpiece, such as concha or externalauditory canal device. When referencing the PCB herein, reference may bemade to one or more PCBs, systems, sub-systems, components, or theentire device.

PCBs as well as the sub-systems of the wireless earpiece may be testedthroughout the various phases of integration of the wireless earpiece.By utilizing the processes, steps, and methods herein described, theillustrative embodiments provide significant advantages in improving theefficiency of manufacturing production lines for one or more versions ofwireless earpieces. In addition, substantial costs savings may beachieved by removing defective components before the defectivecomponents are further integrated into the wireless earpiece. As aresult, defective devices may be removed more dynamically during themanufacturing process to preserve functioning parts instead ofdiscarding entire systems or sub-systems of the wireless earpiece. Inanother embodiment, the wireless earpiece may represent any number ofwireless devices.

During the described testing processes, the PCBs and correspondingwireless earpieces may be programmed to serially certify functionalityof all component sets of the PCB and wireless earpiece. The testing maybe performed by a testing system utilizing custom jigs that may beconnected or otherwise interface to the PCBs and wireless earpieces. Inone embodiment, the testing, certification, and other processes of theillustrative embodiments may be implemented utilizing phases as hereindescribed.

FIG. 1 is a pictorial representation a test in system 100 in accordancewith an illustrative embodiment. In one embodiment, the testing system100 may be configured for testing an external auditory canal device,such as the wireless earpiece including the PCB 104. The testing system100 may mill any number devices or components or be configured invarious ways for performing the processes herein described.

In one embodiment, the testing system 100 may include a computing device106, an interface 108, testing jigs 110, one or more devices under test(DUT) 102, reference device 116, and an interface 118.

The computing device 106 may be a desktop computing device, specializedcomputing device, tablet, one or more servers, databases, or otherdevice(s) for testing the DUT 102. The computing device 106 mayrepresent one or store computing devices that are configured tocommunicate or otherwise interface with the DUT 102. In one example, thecomputing device 106 may represent a personal computer, server, anddatabase for storing testing information for a number of DUTs.

The computing device 6 may have dedicated hardware and logic, such assignal generators, transceivers, signal processors, light sensors,microphones, speakers, sensors, and measuring devices that may beutilized to measure the performance, characteristics, and responses ofthe DUT 102. In another embodiment, the computing device 106 may includedatabases or instructions that are executed by a processor of thecomputing device to perform testing. For example, a set of instructionsstored in the non-transitory memory of the computing device 106 may beexecuted to perform the steps herein described.

In another embodiment, all or portions of the measurement equipment maybe integrated with or connected to the testing jigs 110. The computingdevice 106 may also be connected to one or more data or wirelessnetworks. For example, the computing device 106 (as well as the DUT 102may communicate with one or more wireless networks (e.g., Bluetooth,WiFi, cell, Zigbee, etc.), local area networks or other wired networks(e.g., Ethernet, powerline, fiber optics, etc.) The networks mayrepresent any number of public and private networks (e.g., the Internet)operated by one or more service providers. For example, testing scripts,programs, updates, or instructions may be retrieved through a number ofinterconnected networks including a private WiFi network, local areanetworks, and public or cloud networks.

The interface 108 and 118 may represent a serial connection, cable, orwire connected between the computing device 106 and the DUT 102 and thecomputing device 106 and the reference device 116, respectively. Forexample, the interfaces 108 and 118 may be USB connections from thecomputing device 106 to the DUT 102 and the reference device 116. Theinterfaces 108 and 118 may also represent wireless connections, such asBluetooth, WiFi, near field communications, radio frequency (RF)communications, or other wireless connections that may be establishedutilizing transmitters, receivers, or transceivers. As a result, thefunctional aspects of the DUT 102 may be tested.

The testing jigs 110 physically secure the DUT 102 as well aselectrically interface with the DUT 102 as a whole as well as individualcomponents of the DUT 102 to fully test the DUT 102 and thecorresponding PCBs 104. For example, the testing jigs 110 maymechanically secure the DUT 102 utilizing one or more clamps or arms.The testing jigs 110 may also include wires, micro interfaces (e.g.,micro USB, etc.,), BLUETOOTH or other wireless systems such as radiofrequency antennas or other electrical interfaces for connecting,probing, or programming to any number of test points of the PCBs 104.

The reference device 116 may be utilized to generate reference signalsfor the testing and measuring the DUT 102. In addition, the referencedevice 116 may be utilized to communicate with the DUT 102 to performfunctionality testing as is herein described. The wireless earpiece 102ma be configured for use as a pair (i.e., left ear and right ear). Thereference device is used to test the magnetic induction link, to controland trace the semi-assembled DUT 102. The reference device 116communicates via a gateway to the DUT 102. The reference device may testall major PCB component subsystems; a passing grade allows the PCB tomove further down the assembly line for integration into the assembledproduct.

FIG. 2 is a flowchart of a process for testing a PCB of a wirelessearpiece in accordance with an illustrative embodiment. The processes ofFIGS. 2-4 may be implemented utilizing a testing system or device andmay include multiple phases or steps as herein described. The processesmay be performed on a single device at a time or for multiple devices inbatches or runs of devices. In one embodiment, the PCBs of the wirelessearpiece are produced on a panel that may include PCBs for a number ofdifferent devices. The test sequence may be run on each PCB associatedwith a device on a panel (of which each PCB may also be referred to as adevice under test—DUT 102), The testing of PCBs on the panel may beperformed in parallel, serially, or sequentially. Any PCBs that failtesting may be reworked (e.g., modified, refurbished, discarded,recycled, etc.). Reworking at a rework station may provide enhanced testresult information for testers. After all the PCBs have been tested onthe panel, the successfully evaluated devices may be removed from thepanel fur integration in a final product. Robotics and computerizedtesting logic (e.g., logic circuits, firmware, scripts, etc.) may beutilized to minimize manual user intervention in the process. Forexample, robotics may be used to connect the PCB/DUT to the testing jig,as well as to identify passing PCBs and select these for furtherassembly line integration, leaving the PCBs that do not pass on the maincircuit board assembly for reworking.

The process of FIG. 2 may begin by initiating an automated productionpanel testing (step 200). In one embodiment, the system may include apersonal computer, server, or other computing device that may bephysically connected to a customized PCB. The computing device may beconnected to a number of testing devices and equipment that interfacewith the PCB. In one embodiment, the system may utilize a unique radiofrequency (RF) antenna connected to an RF test box. For example, thepanel may be enclosed in a RF test box that isolates outside radiofrequencies for more accurate testing, if there is a problem with thepanel, the panel may be conveyed 210 to a single rework station 214attached to a monitor 212. The single rework station 214 may providedetailed data regarding the specific reason(s) for the original testfailure. At this point, either the system corrects the issue and returns216 the DUT back for automated production panel testing 200 or else itis rejected 219.

Next, the system performs semi-assembly testing of the wireless device(step 202). During step 202, the semi-assembly of the DUT is testedutilizing a jig that connects the semi-assembled DUT to the system fixautomated testing. If there is a problem with the semi-assembly, thesemi-assembly may be conveyed 220 to a single rework station 224attached to a monitor 222. The single rework station 224 may providedetailed data regarding the specific reason(s) for the original testfailure. At this point, either the system corrects the issue and returns226 the semi-assembly back for automated semi-assembly testing 202 orelse it is rejected 229.

Next, the system performs end-of-line functionality testing (step 204).During step 204, the wireless device may be completely formed with thebattery fully enclosed inside the device. As before, custom-built jigsmay be utilized for final testing of the light sensitive componentry. Inone embodiment, a reference wireless earpiece may be utilized fortesting the DUT. In one embodiment, the reference wireless earpiece isused to test the NFMI antenna and chip combination by communicating insuch a way as to test the limits of the NFMI antenna of the DUT andreplicating the most extreme conditions expected to be encountered bythe DUT. The DUT is expected to communicate without errors and at thelimits of the connection range. The testing jig utilized during step 204may expose any of the potential NFMI linkage errors of the DUT. Thetesting jig is also utilized to test the pulse oximeter, touch sensors,and red green and blue (RGB) light emitting diodes (LEDs). In oneembodiment, the jig may include a mechanical arm for engaging oractivating the touch sensor(s). The testing jig may also emulate a pulsefor testing the pulse oximeter. The testing jig may include may includelight sensors or devices for detected or reflecting light generated bythe LEDs. In one embodiment, the DUT may be light insulated or otherwiseenclosed within a shield to ensure that ambient light does not affectthe results of the testing. In another embodiment, the DUT itself isutilized to measure the LED and pulse oximetry outputs by reflecting thelight emitted back onto the sensor contained within the DUT. If the DUTfails the testing, the DUT is rejected 239.

Next, the system performs final acoustic testing (step 206) with theprocess terminating thereafter. During the final acoustic testing ofstep 206, a customized testing jig is utilized to perform testing. Thetesting of step 206 may be performed in an acoustically isolated chamberor room for testing the external auditory canal (EAC) microphone whichmay be a bone microphone tuned to detect vibrations of the surroundingbony structures, EAC speaker, ambient microphone located on thesuperolateral segment, and audio over the NFMI linkage of the DUT.

During step 206, audio may be played into the ambient microphone of theDUT and then retransmitted by the EAC loudspeaker and recorded by themicrophone placed underneath the testing jig. The recorded audio maythen be analyzed against the reference signal. In one embodiment, thereare four segments analyzed including: low—for example, 100+ Hz (testingof microphones and speakers for bass), mid—for example, 1000 Hz+ testingfor obstruction, high—for example, 3000 Hz+ testing for reference andcalibration, and white noise—looking for gaps or peaks, resonancefrequencies, or blockages.

Audio may also be played into the EAC microphone and then transmitted bythe NFMI to the reference wireless earpiece in the testing jig. Thereference wireless earpiece may then send the audio to the computerwhere the signal may be analyzed against the reference signal. If itfails here, it is rejected. 249. After successful performance of finalacoustic testing, the successfully produced DUT is sent for packaging208.

In one embodiment, a single customized jig may be utilized to performtesting during the different steps of FIG. 2. The illustrativeembodiments provide point of production analysis and identification ofcomponent set issues. The illustrative embodiments maximize theefficiency of production, recognition failures much earlier in theproduction process and save money through minimizing the waste offunctional component sets coupled to failed components. By funding theproblems earlier the process, components may not be irreversiblycombined. In some cases, the problems may be diagnosed for preventingother devices from suffering from similar issues. Additionally, somecomponents may be saved for reworking, reusing, or recycling whereappropriate.

FIG. 3 is a flowchart of a process for initiating an automatedproduction panel testing in accordance with an illustrative embodiment.In one embodiment, the process of FIG. 3 may correspond to step 200 ofFIG. 2. First, the system tests component sets of the PCB for energyconsumption (step 302). The system may ensure that the energyconsumption (as well as the other testing measurements of the processesdescribed herein) is within designated tolerances, thresholds, or ranges(e.g., voltage, current, power in Watts, etc.). Upper, lower, and medianmeasurement values may be specified. Alarms may be generated or the PCBmarked for reworking in response to failing any of the tests. Forexample, a database of the testing system may be utilized to track thetest results (including failures) for subsequent analysis. A serialnumber, bar code, radio frequency tag, or other assigned identifier maybe utilized to associate the PCB or components with the test results andmeasurements.

Next, the system programs intelligent components on the PCB (step 304).The PCB may include any number of intelligent or programmablecomponents, such as Bluetooth chips, logic chips, field programmablegate arrays (FPGAs), processing chips (e.g., Kinetics ARM chip), and soforth.

Next, the system performs RF testing (step 306). In one embodiment, theBluetooth device or RF components (e.g., Bluetooth transceiver, WiFitransceiver, etc.) may be instructed to transmit and/or receive on aplanned frequency with crystal trimming being performed. Frequencyadjustments may be performed to tune or tweak the frequencytransmissions of the RF transceiver.

Next, the system tests Bluetooth of the PCB (step 308). In oneembodiment, a number of tests may be implemented and measured accordingto the preset standards. In one embodiment, test data is transmitted toa receiver of the system and evaluated for errors. In addition, a noisebaseline or floor may be set for the Bluetooth components of the PCB.

Next, the system performs a battery protection test of the PCB (step310). The PCB and corresponding circuits will be checked to verify thatthe system is configured to utilize minimal current when battery voltageis below the manufacturer's minimum specification. Next, the systemtests normal battery charging capabilities of the PCB (step 312). In oneembodiment, the voltage and current utilized to charge the battery maybe determined as well as the capacity of the battery when fully charged.

Next, the system removes external power and measures power usage (step314). During step 314, the system verifies that the PCB utilizes powerwithin a specified range when drawing power from the internal batteryconnection.

Next, the system tests to verify the microcontroller of the PCB is ableto connect to the touch sensor, accelerometer, memory, and near-fieldmagnetic induction (NFMI) chip (step 316). In one embodiment, testsignals may be sent to each of the various sub-systems (e.g., touchsensor, accelerometer, memory, NFMI chip, radio frequency identificationtag, gyroscope, etc.). Once the testing of FIG. 3 is complete, thesystem powers down the PCB. After a short delay the PCB is connected toa USB or other interface. The system may then determine the size of thememory available on the PCB. Configuration of the memory or uploading ofdefault files may also be performed as needed.

FIG. 4 is a flowchart of a process for performing semi-assembly of thewireless device in accordance with an illustrative embodiment. In oneembodiment, the testing of FIG. 4 may correspond to step 202 of FIG. 2.The PCB may be expensive to manufacture and as a result anelectro-mechanical testing jig as previously described may be utilizedto interface all or portions of the system (e.g., a computing device)with the PCB.

The process begins by fitting the lateral segment and the medial segmentof the DUT to the jig (step 402). At this point, both the lateral andmedial segments, (or sub-assemblies) are separate and have not yet beenfused together allowing for Changes to be made as needed before finalassembly. If there is a failure of either of the lateral or medialsegments, the segment may be reworked to reduced costs and minimizewastes. The medial segment is the portion of the MT that is destined tobe placed closest to the tympanic membrane.

Next, the system verifies functionality by loading an initializationfile through the jig (step 404). The system loads internal software forthe DUT to do testing. During step 404, the DUT is rebooted from theUSB. The OUT is then ready to operate as if fully integrated. During thereboot, the DUT is expected to reboot with verification of the variousinternal devices including NFMI antenna (e.g., calibration), battery,pulse oximeter, amplifier, and other sub-systems and components.

Next, the system reconnects to the DUT to re-enumerate as a mass storagedevice (step 406). The system may be reconnected through an interface,such as a USB connection. During step 406, the initialization filepreviously loaded is deleted from the DUT. In addition, a trace fileutilized to document functionality of the components of the DUT iscopied and removed from the DUT for analysis and to determine if thereare any errors.

Next, the system copies all files onto the DUI (step 408). If the DUTcontinues to pass each step of FIG. 4, the system copies all of thesystem, audio, and other files. At any time during the process of FIG. 4if a failure occurs, the particular sub-system, such as the lateral ormedial segment, is marked for reworking and further processed. After theprocess of FIG. 4, the sub-assemblies may be welded together.

The illustrative embodiments may take the form of an entirely hardwareembodiment, an entirely software embodiment (including firmware,resident software, micro-code, etc.) or an embodiment combining softwareand hardware aspects that may all generally be referred to herein as a“circuit,” “module” or “system.” Furthermore, embodiments of theinventive subject matter may take the form of a computer program productembodied in any tangible medium of expression having computer usableprogram code embodied in the medium. The described embodiments may beprovided as a computer program product, or software, that may include amachine-readable medium having stored thereon instructions, which may beused to program a computing system (or other electronic device(s)) toperform a process according to embodiments, whether presently describedor not, since every conceivable variation is not enumerated herein. Amachine readable medium includes any mechanism for storing ortransmitting information in a form (e.g., software, processingapplication) readable by a machine (e.g., a computer). Themachine-readable medium may include, but is not limited to, magneticstorage medium (e.g., floppy diskette); optical storage medium (e.g.,CD-ROM); magneto-optical storage medium; read only memory (ROM); randomaccess memory (RAM); erasable programmable memory (e.g., EPROM andEEPROM); flash memory; or other types of medium suitable for storingelectronic instructions addition, embodiments may be embodied in anelectrical, optical, acoustical or other form of propagated signal(e.g., carrier waves, infrared signals, digital signals, etc.), orwireline, wireless, or other communications medium.

Computer program code for carrying out operations of the embodiments maybe written in any combination of one or more programming languages,including an object oriented programming language such as Java,Smalltalk, C++ or the like and conventional procedural programminglanguages, such as the “C” programming, language or similar programminglanguages. The program code may execute entirely on a user's computer,partly on the user's computer, as a stand-alone software package, partlyon the user's computer and partly on a remote computer or entirely onthe remote computer or server. In the latter scenario, the remotecomputer may be connected to the user's computer through any type ofnetwork, including a local area network (LAN), a personal area network(PAN), or a wide area network (WAN), or the connection may be made to anexternal computer (e.g., through the Internet using an Internet ServiceProvider).

FIG. 5 depicts a computing system 500 in accordance with an illustrativeembodiment, includes a processor unit 501 (possibly including multipleprocessors, multiple cores, multiple nodes, and/or implementingmulti-threading, etc.). The computing system includes memory 507. Thememory 507 may be system memory (e.g., one or more of cache. SRAM, DRAM,zero capacitor RAM, Twin Transistor RAM, eDRAM, EDO RAM, DDR RAM,EEPROM, NRAM, RRAM, SONOS, PRAM, etc.) or any one or more of the abovealready described possible realizations of machine-readable media. Thecomputing system also includes a bus 503 (e.g., PCI, ISA, PCI-Express,HyperTransport®, InfiniBand®, NuBus, etc.), a network interface 505(e.g., an ATM interface, an Ethernet interface, a Frame Relay interface,SONET interface, wireless interface, etc.), and a storage device(s) 509(e.g., optical storage, magnetic storage, etc.). The system memory 507embodies functionality to implement embodiments described above. Thesystem memory 507 may include one or more functionalities thatfacilitate retrieval of the audio information associated with anidentifier. Code may be implemented in any of the other devices of thecomputing system 500. Any one of these functionalities may be partially(or entirely) implemented in hardware and/or on the processing unit 501.For example, the functionality may be implemented with an applicationspecific integrated circuit, in logic implemented in the processing unit501, in a co-processor on a peripheral device or card, etc. Further,realizations may include fewer or additional components not illustratedin FIG. 5 (e.g., video cards, audio cards, additional networkinterfaces, peripheral devices, etc.). The processor unit 501, thestorage device(s) 509, and the network interface 505 are coupled to thebus 503. Although illustrated as being coupled to the bus 503, thememory 507 may be coupled to the processor unit 501.

While the embodiments are described with reference to variousimplementations and exploitations, it will be understood that theseembodiments are illustrative and that the scope of the inventive subjectmatter is not limited to them. In general, techniques for testing andprocessing wireless earpieces, PCBs, and other components as describedherein may be implemented with devices, facilities, or equipmentconsistent with any hardware system(s). Many variations, modifications,additions, and improvements are possible.

Plural instances may be provided for components, operations orstructures described herein as a single instance. Finally, boundariesbetween various components, operations and data stores are somewhatarbitrary, and particular operations are illustrated in the context ofspecific illustrative configurations. Other allocations of functionalityare envisioned and may fall within the scope of the inventive subjectmatter. In general, structures and functionality presented as separatecomponents in the exemplary configurations may be implemented as acombined structure or component. Similarly, structures and functionalitypresented as a single component may be implemented as separatecomponents. These and other variations, modifications, additions, andimprovements may fall within the scope of the inventive subject matter.The previous detailed description is of a small number of embodimentsfor implementing the invention and is not intended to be limiting inscope. The following claims set forth a number of the embodiments of theinvention disclosed with greater particularity.

What is claimed:
 1. A method for testing a wireless earpiece, the methodcomprising: initiating automated testing of one or more printed circuitboards (PCBs) of the wireless earpiece; testing the semi-assembledwireless earpiece; performing end-of-line functional testing; performingfinal acoustic testing of the wireless earpiece.
 2. The method accordingto claim 1, wherein the automated testing is performed utilizing acomputing device connected to the wireless earpiece by one or moretesting jigs.
 3. The method according to claim 1, wherein the automatedtesting is performed on a panel that includes a plurality of PCBS. 4.The method according to claim 1, wherein the wireless earpiecewirelessly communicates with a reference wireless earpiece during theend-of-line functional testing.
 5. The method according to claim 2,wherein the testing jig is configured to test a pulse oximeter, touchscreen, and display lights of the wireless earpiece during theend-of-line functional testing.
 6. The method according to claim 1,wherein the wireless earpiece includes an external auditory canalmicrophone and external auditory canal speaker and ambient microphonethat are tested during the final acoustic testing.
 7. The methodaccording to claim 1, wherein the wireless earpiece is radio frequency,light, and sound shielded during testing.
 8. The method according toclaim 1, wherein initiating automatic production panel testing furthercomprises: testing component sets of the PCB for energy consumption;programming intelligent components on the PCB; performing radiofrequency testing of the PCB; testing battery charging capabilities ofthe PCB; measuring power usage; and verifying a microcontroller of thePCB is connected to components of the PCB.
 9. The method according toclaim 1, wherein performing radio frequency testing of the PCB includestesting Bluetooth communications to and from the PCB.
 10. The methodaccording to claim 1, wherein performing semi-assembly of the wirelessearpiece further comprises: fitting a later segment and medial segmentof the wireless earpiece to the one or more testing jigs; verifyingfunctionality by loading an initialization file through the testing jig;reconnecting to the wireless earpiece to re-enumerate as a mass storagedevice: and copying all files onto the wireless earpiece.
 11. A systemfor testing a wireless earpiece, the system comprising: a computingdevice connected to the wireless earpiece; a reference wireless earpiececonnected to the computing device, wherein the computing device isconfigured to: initiate automated testing of one or more printed circuitboards (PCBs) of the wireless earpiece, test the semi-assembled wirelessearpiece, perform end-of-line functional testing, and perform finalacoustic testing of the wireless earpiece.
 12. The system according toclaim 11, wherein the computing device is connected to a database forstoring test results and measurements for the wireless earpiece.
 13. Thesystem according to claim 11, wherein the computing device is furtherconfigured to: test component sets of the PCB for energy consumption;intelligent components on the PCB; perform radio frequency testing ofthe PCB; test battery charging capabilities of the PCB; measure powerusage; and verify a microcontroller of the PCB is connected tocomponents of the PCB.
 14. The system according to claim 13, wherein thecomponents of the PCB include at least pulse oximeter, touch screen, anddisplay lights of the wireless earpiece.
 15. A testing devicecomprising: a processor for executing a set of instructions; and amemory for storing the set of instructions, wherein the set ofinstructions are executed to: initiate automated testing of one or moreprinted circuit boards (PCBs) of the wireless earpiece; semi-assemblytesting of the wireless earpiece; perform end-of-line functional testingof the wireless earpiece; perform final acoustic testing of the wirelessearpiece.
 16. The testing device according to claim 15, wherein the setof instructions are further executed to: test component sets of the PCBfor energy consumption; program intelligent components on the PCB;perform radio frequency testing of the PCB; test battery chargingcapabilities of the PCB; measure power usage; and verify amicrocontroller of the PCB is connected to components of the PCB. 17.The testing device according to claim 15, wherein the set ofinstructions are further executed to: functionality by loading aninitialization the through the testing jig, wherein a lateral segmentand medial segment of the wireless earpiece to the one or more testingjigs; re-enumerate the wireless earpiece as a mass storage device; andcopy all files onto the wireless earpiece.
 18. The testing deviceaccording to claim 15, wherein the testing device performs testing on apanel that includes a plurality of PCBs including the PCB of thewireless earpiece.
 19. The testing device according to claim 15, whereinthe radio frequency testing includes testing short-range communicationsto and from the PCB.